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MAX2091
50MHz to 500MHz Analog VGA, 1735MHz to 1935MHz
Upconverting Mixer with Image Filtering, Threshold
Alarm Circuit, and Error Amplifier for Level Control
ABSOLUTE MAXIMUM RATINGS
V CC_A , V CC_IF , V CC_LO , V CC_RF ............................-0.3V to +6V
IF_IN, MIX_IN, IF_OUT, LO+, RF_OUT .......-0.3V to V CC + 0.3V
ALM, R_BIAS, DET_VIN, AMP_OUT, LO- ............-0.3V to +3.6V
ALM_THRES, PLVLSET,
CTRL1, CTRL2..........-0.3V to MINIMUM (V CC + 0.3V, +3.6V)
IF_IN, MIX_IN Input Power ........................................... +15dBm
Operating Case Temperature
Range (Note 2) ............................................... -40 N C to +95 N C
Maximum Junction Temperature....................................... 150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering 10s) ................................... 300 N C
Soldering Temperature (reflow) ......................................+260 N C
Continuous Power Dissipation (Note 1) ..............................2.5W
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
Junction-to-Ambient Thermal Resistance ( q JA )
(Notes 3, 4) ............................................................... +29°C/W
Junction-to-Case Thermal Resistance ( q JC )
(Notes 1, 4) ................................................................. +7°C/W
Note 1: Based on junction temperature T J = T C + (θ JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150°C.
Note 2: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Note 3: Junction temperature T J = T A + (θJA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150 N C .
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = 4.75V to 5.8V, V GND = 0V, P LO = -10dBm to -4dBm, and T C = -40°C to +95°C. Typical values are
at V CC = 5.5V, P LO = -7dBm, and T C = +25°C, unless otherwise noted.) (Note 5)
PARAMETER
Supply Voltage
SYMBOL
V CC
CONDITIONS
MIN
4.75
TYP
5.5
MAX
5.8
UNITS
V
CTRL1 = 1, CTRL2 = 1
264
290
Total Supply Current
I DC
CTRL1 = 1, CTRL2 = 0
CTRL1 = 0, CTRL2 = 0
254
8.5
15
mA
CTRL1/CTRL2 Logic-Low Input Voltage
CTRL1/CTRL2 Logic-High Input Voltage
V IL
V IH
2.2
0.8
V
V
CTRL1/CTRL2 Input Logic Current
PLVLSET Input Resistance
PLVLSET Input Voltage Range
I IH /I IL
R IN
-10
650
0
10
2.5
F A
k I
V
PLVLSET Minimum Control Voltage
PLVLSET Maximum Control Voltage
0
2.3
0.1
2.4
0.2
2.5
V
V
DET_IN Input Voltage Range
ALM_THRES Input Resistance
V IN
0
90
135
2.5
V
k I
Alarm Output Logic 1
Alarm Output Logic 0
DET_VIN Input Resistance
3.135
175
3.3
235
3.465
0.4
295
V
V
k I
2
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